ADDITIONAL PRODUCT NEWS

INCOE’s Microcom Controller Optimizes Hot Runner Performance 

INCOE’s next generation of advanced MICROCOM hot runner temperature control technology delivers a new level of processing control. Unique to this controller is INCOE’s patented voltage correction technology developed for reliable and uninterrupted operation. The technology automatically maintains constant voltage output to the hot runner system; even when line voltages fluctuate. The feature also reduces or eliminates premature heater burn out.  

Modular by design for maximum flexibility, and with up to 48 zones, load protection has been integrated into the new design in the event the Triac control is shorted. Like the patented voltage correction feature, both are designed to eliminate system damage and lost productivity. 

New user friendly features allow for flexible, yet secure management of the molding process. Added user control functionality now includes the selection of two “Soft Start” routines, adjustable min/ max temperature set point limits, pre-set restart procedures and a user enabled lock feature to ensure your process is secure and controlled at all times.  

EnSuite Version 2 Adds New Features 

CCE has announced the release of a new update of EnSuite Version 2 - its multi-CAD viewing, translation and productivity software.  

This release provides a wide range of new features including the ability to view two models superimposed on top of each with the differences highlighted. It also provides the ability to isolate a part from a complex assembly by making the rest of the assembly transparent. Another new capability enables users to search for features based on parameter values. 

EnSuite Version 2 also offers several other new features. Users can measure geometric dimensions of lines, circles, edges, angles, etc. They can cut cross-sections and check properties such as perimeter, area, volume, etc. Stepped holes that have been counter-bored or counter-sunk can also easily be measured including the values of chamfers and fillets. 

EnSuite provides seamless interoperability with the CATIA V4, CATIA V5, Pro/ENGINEER, Unigraphics, and SolidWorks CAD systems as well as Parasolid, IGES and STEP files. Files can be translated to and from any of these formats without the native CAD software.  

FARO Releases New Photon 3-D Laser Scanner 

FARO Technologies, Inc. announced the launch of its new family of 3-D Laser Scanners called Photon 80 and Photon 20. The new Photons, which replace the Company’s Laser Scanner LS 880, 840 and 420, offer greater clarity, accuracy and portability. 

The FARO Photon Laser Scanner is a portable, computerized measurement device that scans, digitally recreates and records all of an object or area’s dimensions, creating what looks like a “photograph” on the computer screen – but in 3-D. The captured data can be used to create a digital model for reverse-engineering, quality assurance, inspection, CAD-to-part comparison, factory planning, investigation, and automatic object recognition in modelling. 

The new Photon’s sleek styling is fortified by technological advancements, including:

• 300% less noise for greater clarity

• 200% better positional accuracy

• Higher sensitivity for better detection of objects that are distant, darker and more oblique

• Easy high-quality color overlay

• Increased mirror rotation speed

• Faster minimal scanning times

Among the new accessories is a high-definition color bracket, as well as a handle for safe and simple portability. When combined with the super-compact Power Base Battery, the Photon offers more than six hours of uninterrupted scanning performance.

Moldflow Announces Plastics Advisers 8.1 

Moldflow Corporation recently announced the release of Moldflow Plastics Advisers® (MPA®) 8.1, the easy-to-use plastics simulation software that allows part and mold designers to quickly evaluate the manufacturability of their designs so they can achieve the highest quality at the lowest cost in the shortest time to market.

MPA 8.1 delivers new technologies and key enhancements to help users analyze a broader range of parts with true 3D technology, improve productivity with a redesigned user interface, shorten analysis preparation time with powerful and flexible modeling tools, interpret results more efficiently using new results visualization options, and increase collaboration with expanded communication capabilities.

MPA 8.1 features true 3D analysis capability for the simulation of parts with thick, solid regions or variations in wall thickness. As plastics part geometry becomes increasingly more complex, the 3D technology in MPA allows customers to predict and avoid manufacturing defects before a mold is ever made, saving them costly and time-consuming production delays.